Tokyo Electron US

10/21/2026

From academia to innovation in the semiconductor industry.

In the latest Corporate Blog of Tokyo Electron (TEL), Daniel Chen, co-founder of Taiwan-based startup Naidun-tech and now with TEL Taiwan, shares the company's journey from a university research laboratory to a growing semiconductor technology startup.

Highlights from the story:

✅How Naidun-tech transformed academic research into real-world semiconductor solutions

✅The challenges of funding and scaling a deep-tech startup

✅ How support from TEL Venture Capital helped accelerate growth and build credibility

✅Why collaboration with TEL enabled the company to advance its technology and expand its global potential

✅The role of partnerships and innovation in shaping the future of the semiconductor industry

▶️Read the full story:

Founded by Daniel Chen and Kyle Li, Naidun-tech is a startup aiming to improve semiconductor reliability using supercritical fluid (SCF) technology developed in a laboratory at National Sun Yat-sen University in Taiwan. This article looks back on Daniel’s journey, from overcoming fundraising chall...

10/14/2026

AI demand is changing more than what chips can do. It’s changing how they’re made.

As devices become more advanced, semiconductor manufacturing is being pushed toward greater precision, efficiency and control, all while managing increasingly complex processes.

At , ’s Yoshinobu Mitano will explore the role equipment and process technology can play in meeting those demands, from reducing energy and resource use to enabling more advanced manufacturing.

📅 Thursday, Oct. 15 | 11:35 AM
📍 Moscone Center, North Hall, Lower Level, Room 20

See where technology meets the demands of the AI era.

10/14/2026

The smarter and more connected manufacturing becomes, the more important cybersecurity becomes with it.

This afternoon Andrew Seward will join industry experts for a cybersecurity panel examining a challenge that now reaches across the semiconductor ecosystem.

From protecting connected environments to preparing for emerging risks, security is becoming an increasingly important part of the conversation around the fab of the future.

📅 Wednesday, Oct. 14 | 4:15 PM
📍 Moscone Center, South Hall, Upper Mezzanine, Room 158

10/14/2026

is officially underway, and TEL is helping get the conversation started.

TEL’s own Eiji Hagio and Thurston Taylor will help kick off Wednesday’s programming with welcome and opening remarks.

It’s the start of a full day for , with our experts joining discussions across the show floor on the technologies, people and challenges shaping semiconductor manufacturing.

📅 Wednesday, Oct. 14
📍 Moscone Center

Follow along as we share more from .

10/13/2026

The team is on the ground in San Francisco, and is officially underway!

We’re connecting with industry peers, sharing expertise and joining conversations about the opportunities shaping semiconductor manufacturing.

A great start to what promises to be a busy week!

10/13/2026

AI is accelerating semiconductor demand. The bigger question is how we grow with it.

At , TEL COO Jack Ishida takes the CEO Summit stage for his keynote presentation, “Powering Sustainable Growth in the AI Era.”

As AI drives another wave of semiconductor growth, the industry has an opportunity to think bigger than meeting demand alone. Jack will share ’s perspective on advancing the technology behind that growth while keeping sustainability part of the equation.

📅 Thursday, Oct. 15 | 10:05 AM
📍 CEO Summit Stage | Moscone Center, North Hall

One of TEL’s biggest conversations of the week. Don’t miss it.

10/12/2026

A connected semiconductor ecosystem needs security that can keep up.

As manufacturing environments become more connected, cybersecurity is moving well beyond the IT department. Standards, governance and compliance increasingly have to work alongside the realities of the fab.

Sri Peddi will join the discussion on turning cybersecurity requirements into practical approaches that strengthen operational technology environments and prepare organizations for what comes next.

📅 Wednesday, Oct. 14 | 12:30 PM
📍 Moscone Center, South Hall, Upper Mezzanine, Room 158

10/09/2026

More computing power. More bandwidth. More complexity packed into less space.

The rise of HPC and AI is pushing advanced packaging into increasingly demanding territory, creating new challenges across processes, materials and metrology.

At next week, ’s James Papanu and Elliott Tan will take a closer look at the technologies and toolsets behind that shift, including hybrid bonding, laser processing and other approaches helping enable the next generation of HPC and AI.

📅 Wednesday, Oct. 14 | 10:35 AM
📍 Mezzanine, Room 156

If advanced packaging is on your radar, put this one on your schedule.

10/09/2026

The semiconductor talent gap isn’t just about finding more people. It’s about creating more ways in.

As new fabs come online and technology becomes more complex, the industry needs a workforce that can grow with it.

Rosanna Gannon will explore how cross-industry networks, mentorship and stronger connections between companies can help expand pathways into semiconductors and keep experienced talent engaged.

Because closing the workforce gap will take more than recruiting. It will take an industry working together.

📅 Wednesday, Oct. 14 | 11:00 AM
📍 Moscone Center, North Hall, Expo Floor

10/08/2026

Semiconductor fabs are already among the most automated manufacturing environments in the world, but automation and autonomy are not the same thing. Physical AI is only becoming more capable, so we are thinking deeply about autonomy in the fab.

Moving toward a fab that can learn and adapt introduces a different set of questions. How are tools built for robots as well as people? Where can physical AI create value across the tool lifecycle? How do fabs, equipment providers, and technology providers work together to build systems that can learn from the manufacturing environment?

Next week at , Dr. Akihisa Sekiguchi, Senior Vice President and General Manager of TEL U.S. will join a panel moderated by NVIDIA titled “Physical AI in the Fab: Robotics, Simulation, and Next-Generation Fab Autonomy.” The discussion will bring together leaders from across the ecosystem to explore what it will take to move beyond fixed automation toward a more intelligent and flexible manufacturing environment.

See the details here: http://spklr.io/6183EpaAh